Chipletz

Austin, United States Founded: 2021 • Age: 5 yrs
Provider of fabless substrate designer for packaging of ICs
Annual revenue - Latest available
Total funding - 1 rounds
Employees - Tracked headcount
Investors 1 Known backers
Products 1 Services tracked
Competitors 10 Brand Intelligence

About Chipletz

Chipletz is a company based in Austin (United States) founded in 2021 by MeeLan Lee, Michael Su, Bryan Black, and Michael Alfano. Chipletz offers products and services including Smart Substrate. Chipletz operates in a competitive market with competitors including Kandou Bus, Xperi, Quantum Leap Packaging, Si2 Microsystems and Micro Components, among others.

  • Headquarter Austin, United States
  • Founders MeeLan Lee, Michael Su, Bryan Black, Michael Alfano
  • Sectors
    Technology
  • Phone
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  • Website
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  • Social
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  • Legal Name Chipletz, Inc.
Operational Areas
Technology → Semiconductors, Electronics & Hardware Unlock Sub-Sector Unlock Segment
Key Metrics
  • Annual Revenue
    Not available
  • Net Profit
    Not available
  • EBITDA
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  • Latest Funding Round
    Not available
  • Investors
  • Employee Count
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Products & Services of Chipletz

Chipletz offers a comprehensive portfolio of products and services, including Smart Substrate.

Product name locked
Category locked
Primary

Technology for integrating chips in AI and HPC without interposers.

Funding Insights of Chipletz

Investors in Chipletz

Chipletz has secured backing from 1 investor, including institutional investors. Prominent investors backing the company include SKC Ltd.

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Institutional
Investor Description Founded Year Domain Location
Air sampling equipment and solutions are provided by SKC Ltd.
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Investor details for Chipletz

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Investments & Acquisitions by Chipletz

Investments
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Investment portfolio details for Chipletz

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Financial Statements - Chipletz

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Detailed financials for Chipletz

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Chipletz Comparisons

Chipletz Primary company
Description
Provider of fabless substrate designer for packaging of ICs
Location
Austin, United States
Founded Year
2021
Annual Revenue
Not available
Net Profit
Not available
EBITDA
Not available
Employees
Not available
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Peer comparison for Chipletz

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Competitors of Chipletz

Chipletz operates in a dynamic and competitive business environment, facing competition from various established players and emerging companies in the market. The competitive landscape includes prominent companies such as Kandou Bus, Xperi, Quantum Leap Packaging, Si2 Microsystems and Micro Components, among others.

Company Name Domain Founded year HQ Location Description
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Delivers comprehensive solutions for programmable IPs in package applications.
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Xperi is engaged in developing technologies for extraordinary entertainment experiences.
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Low-cost, high-performance LCP packaging is developed for semiconductors.
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Blog focused on nurse job, salary, workplace, and other related topics
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Offers comprehensive semiconductor packaging solutions.
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Detailed competitors of Chipletz

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Latest news on Chipletz

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Complete news archive for Chipletz

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Frequently Asked Questions about Chipletz

Chipletz was founded in 2021 and raised its 1st funding round 2 years after it was founded.

Chipletz is headquartered in Austin, United States. It is registered at Austin, Texas, United States.

Bryan Black is the current CEO of Chipletz. They have also founded this company.

Provider of fabless substrate designer for packaging of ICs. It develops substrate boards for packaging IC chips. It is applicable for AI workloads, immersive consumer experiences, and high-performance computing.

Chipletz's top competitors include Xperi, Quantum Leap Packaging and Si2 Microsystems.

Chipletz offers Smart Substrate.

Chipletz has 1 investor. Key investors include SKC Ltd.

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