About C.P. Environmental
C.P. Environmental is a company based in Alsip (United States) founded in 1973, and was acquired by Micronics in March 2015. It operates as a semiconductor back-end equipment is manufactured and designed. Its chief executive is Bernard Faulkner.
Company details
Founded in 1973 and based in Alsip, United States, semiconductor back-end equipment is produced by the company for the electronics sector. Machinery is designed for wafer handling, testing, and packaging processes, including high-bandwidth memory singulation, EMI shielding, laser marking, pick-and-place operations, flip chip handling, and PCB substrate solutions. Operations support smart factories and wafer-level packaging in the global semiconductor industry.
- Headquarters Alsip, United States
- Stage Acquired
- Email••••••••
- Phone•••• ••••
- Website cp-environmental.com
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- Acquired by Micronics (Mar 2015)
Investors in C.P. Environmental
C.P. Environmental has secured backing from 1 investor. Prominent investors backing the company include Micronics.
| Investor | Description | Founded Year | Domain | Location |
|---|---|---|---|---|
Engineered filtration solutions are manufactured for diverse industries worldwide. | 1983 | micronicsinc.com | Portsmouth, United States |
Investor details for C.P. Environmental
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People of C.P. Environmental
1 people are tracked at C.P. Environmental (1 in leadership).
| Name | Role | Group |
|---|---|---|
Bernard Faulkner | CEO & President | Leadership |
Complete people profiles for C.P. Environmental
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Timeline of C.P. Environmental
2 dated milestones of C.P. Environmental across 42 years, from founding to its latest funding, stage changes and deals.
- Founded C.P. Environmental is founded.
- Exit Acquired by Micronics.
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Frequently Asked Questions about C.P. Environmental
C.P. Environmental was founded in 1973.
C.P. Environmental is headquartered in Alsip, United States. It is registered at Alsip, Illinois, United States.
Bernard Faulkner is the current CEO of C.P. Environmental.
Founded in 1973 and based in Alsip, United States, semiconductor back-end equipment is produced by the company for the electronics sector. Machinery is designed for wafer handling, testing, and packaging processes, including high-bandwidth memory singulation, EMI shielding, laser marking, pick-and-place operations, flip chip handling, and PCB substrate solutions. Operations support smart factories and wafer-level packaging in the global semiconductor industry.
C.P. Environmental has 1 investor. Key investors include Micronics.
Yes. C.P. Environmental was acquired by Micronics in March 2015.