EoPlex

San Jose, United States Founded: 2001 • Age: 25 yrs
Electronic component designer and manufacturer
Annual revenue - Latest available
Total funding $16.1M 3 rounds
Employees 1 Tracked headcount
Investors 4 Known backers
Products - Services tracked
Competitors 7 Brand Intelligence

About EoPlex

EoPlex is a company based in San Jose (United States) founded in 2001. EoPlex has raised $16.09 million across 3 funding rounds from investors including ATA Ventures, Labrador Ventures and DFJ. The company has 1 employees as of December 31, 2020. EoPlex operates in a competitive market with competitors including PMC-Sierra, Praxis Packaging, Epec, Tray-Pak Corporation and Universal Protective Packaging, among others.

  • Headquarter San Jose, United States
  • Employees 1 as on 31 Dec, 2020
  • Sectors
    Technology
  • Email
    Locked
  • Phone
    Locked
  • Website
    Locked
  • Social
    Locked
  • Legal Name Eoplex, Inc.
Operational Areas
Technology → Semiconductors, Electronics & Hardware Unlock Sub-Sector Unlock Segment
Technology → Robotics, Automation & Advanced Manufacturing Unlock Sub-Sector Unlock Segment
Key Metrics
  • Annual Revenue
    Not available
  • Net Profit
    Not available
  • EBITDA
    Not available
  • Total Equity Funding
    $16.09 M (USD)

    in 3 rounds

  • Latest Funding Round
    $3.79 M (USD), Series D

    Nov 23, 2009

  • Investors
  • Employee Count
    1

    as on Dec 31, 2020

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Funding Insights of EoPlex

EoPlex has successfully raised a total of $16.09M across 3 strategic funding rounds. The most recent funding activity was a Series D round of $3.79 million completed in November 2009. This substantial capital infusion reflects strong investor confidence in the company's business model, growth potential, and market opportunities. The funding enables strategic expansion, product development, market penetration, and operational scaling to drive long-term value creation and competitive advantage.

Investors in EoPlex

EoPlex has secured backing from 4 investors, including venture fund investors. Prominent investors backing the company include ATA Ventures, Labrador Ventures and DFJ.

All
Venture Fund
Investor Description Founded Year Domain Location
Seed and early-stage investments are made in US tech companies.
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-
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US focused VC firm
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Investor details for EoPlex

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Investments & Acquisitions by EoPlex

Investments
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Investment portfolio details for EoPlex

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Financial Statements - EoPlex

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Detailed financials for EoPlex

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Eoplex Comparisons

EoPlex Primary company
Description
Electronic component designer and manufacturer
Location
San Jose, United States
Founded Year
2001
Annual Revenue
Not available
Net Profit
Not available
EBITDA
Not available
Employees
1
As of 2020
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Peer comparison for EoPlex

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Competitors of EoPlex

EoPlex operates in a dynamic and competitive business environment, facing competition from various established players and emerging companies in the market. The competitive landscape includes prominent companies such as PMC-Sierra, Praxis Packaging, Epec, Tray-Pak Corporation and Universal Protective Packaging, among others.

Company Name Domain Founded year HQ Location Description
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Developer of semiconductor solutions for multiple industries
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3D printing solutions for packaging design and prototyping are offered.
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Custom-engineered components and inventory solutions are manufactured by Epec.
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Custom thermoformed plastic packaging is produced using 3D-printed molds.
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Protective packaging is designed and produced via 3D printing.
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Detailed competitors of EoPlex

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Latest news on Eoplex

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Complete news archive for EoPlex

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Frequently Asked Questions about EoPlex

EoPlex was founded in 2001 and raised its 1st funding round 3 years after it was founded.

EoPlex is headquartered in San Jose, United States. It is registered at San Jose, California, United States.

Michael Loh Soon Gnee is the current CEO of EoPlex.

EoPlex is a funded company, having raised a total of $16.09M across 3 funding rounds to date.

As of Dec 31, 2020, the latest employee count at EoPlex is 1.

EoPlex designs and manufactures electronic components for OEMs. It 3D prints package components onto removable stainless carrier, used in the manufacturing of QFN packages for multi-die SiP applications. Its additive printing technology (Configurable Sintered Interconnect - CST) deposits metal and ceramic inks for printing semiconductor packaging interconnect. The interconnect layers width is lt; .25 mm and ranges between 2-500 leads. EoPlex claims to have core competencies in material development, multi-material systems, and 3D manufactured tools equipment.

EoPlex's top competitors include Epec, PMC-Sierra and Tray-Pak Corporation.

EoPlex has 4 investors. Key investors include ATA Ventures, Labrador Ventures, DFJ, and Draper Richards.

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