About izmo Microsystems
izmo Microsystems is a company based in Bengaluru (India) founded in 2024. It operates as a B2B. The company has 1 employees as of March 31, 2024. izmo Microsystems offers products and services including SiP Solutions, IC Packaging, RF Assemblies, and Co-Packaged Optics.
- Headquarter Bengaluru, India
- Employees 1 as on 31 Mar, 2024
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Sectors
Technology
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Phone
*********
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Website
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- Legal Name Izmo Microsystems Pvt. Ltd.
- Jurisdiction Bangalore South, Karnataka, India
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Annual Revenue
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Net Profit
-$40.27 K (USD)0as on Mar 31, 2024
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EBITDA
-$37.43 K (USD)0as on Mar 31, 2024
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Latest Funding Round
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Investors
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Employee Count
1
as on Mar 31, 2024
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Products & Services of izmo Microsystems
izmo Microsystems offers a comprehensive portfolio of products and services, including SiP Solutions, IC Packaging, RF Assemblies, and Co-Packaged Optics.
Custom packaging for high-density semiconductor systems
Assembly and packaging for reliable IC components
Packaging for radio frequency and microwave systems
Integration solutions for optical components
Funding Insights of izmo Microsystems
Investments & Acquisitions by izmo Microsystems
Financial Statements - izmo Microsystems
Izmo Microsystems Comparisons
Competitors of izmo Microsystems
Frequently Asked Questions about izmo Microsystems
izmo Microsystems was founded in 2024.
izmo Microsystems is headquartered in Bengaluru, India. It is registered at Bengaluru, Karnataka, India.
As of Mar 31, 2024, the latest employee count at izmo Microsystems is 1.
izmo Microsystems is a hi-tech company based in Bangalore, India, focusing on System-in-Package (SiP) miniaturization and IC packaging. They offer custom solutions for high-density, high-performance systems, including advanced photonic integration and assembly services. Utilizing technologies like die-attach, wire bonding, and flip-chip, they ensure optimal electrical and thermal performance. Their facilities feature Class 1000 Clean Rooms for manufacturing, serving industries needing reliable components.
izmo Microsystems offers SiP Solutions, IC Packaging, RF Assemblies, and Co-Packaged Optics.