Siltectra

Dresden, Germany Founded: 2010 • Age: 16 yrs Acquired By Infineon
Laser-based technology for splitting crystalline materials is developed.

About Siltectra

Siltectra is a Technology company based in Dresden (Germany) founded in 2010, and was acquired by Infineon in November 2018. Laser-based technology for splitting crystalline materials is developed. Siltectra offers products and services including Cold Split Technology and SiC Wafer Production. Its focus areas include Semiconductors, Semiconductor and Photonic Materials and Chemicals and Materials. Its legal entity is Siltectra GmbH.

Company details

Siltectra was founded in 2010 in Dresden, Germany, where laser-based technology for splitting crystalline materials, including silicon carbide (SiC), is developed. Thermal stress is employed to cleave materials along desired planes with minimal loss, outperforming traditional sawing in efficiency. Wafer yield per boule is thereby increased, while consumable costs are lowered. The technology is utilized in semiconductor manufacturing and other sectors requiring precise material separation.

Key Metrics

Products & Services of Siltectra

Siltectra offers a comprehensive portfolio of products and services, including Cold Split Technology and SiC Wafer Production.

Cold Split Technology
Semiconductor Processing

Cold split technology is employed to split crystalline materials with minimal loss, enhancing wafer production efficiency.

SiC Wafer Production
Manufacturing Services

SiC wafer production is conducted using laser-based techniques for applications in electronics and energy systems.

Apps and channels of Siltectra

its YouTube channel Infineon Technologies has 48.1K subscribers and 30 videos.

Infineon Technologies
YouTube 48.1K subscribers 30 videos Science & Technology
Open channel

Videos from Siltectra

The most watched videos on Siltectra's YouTube channel, Infineon Technologies (48.1K subscribers). Click a video to play it here.

Innovation Impacts: Quantum Computing Reality: What & When | Infineon
2.3K views
Infineon at Computex25 - No AI without power: How to power the future of AI | Infineon
689 views
Technology Development Engineer at Infineon: Innovation Leaders | Infineon
685 views
How the Digital Euro is Transforming Everyday Payments | Infineon
541 views

More on Infineon Technologies.

Funding Insights of Siltectra

  • Total Rounds 2
  • Investors Count 2

All 2 funding rounds of Siltectra with amounts and investors; the two latest post-money valuations are shown, the rest are part of the premium plan.

DateAmountTransaction NameValuationLead InvestorsInvestors
Mar 2017Series A––
Apr 2013Series A––
Valuation history

3 investors in total: 3 institutional.

Investors in Siltectra

Siltectra has secured backing from 3 investors, including venture fund and institutional investors. Prominent investors backing the company include Infineon, MIG Fonds and Global Asset Fund.

All
Venture Fund
Institutional
InvestorDescriptionFounded YearDomainLocation
Venture capital investments in technology companies are managed by MIG Fonds.
mig-fonds.deGermany
global-asset-fund.de
Multiple analog and mixed-signal ICs are manufactured for various applications.
1999infineon.comNeubiberg, Germany
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Investor details for Siltectra

The complete investor list, round-by-round participation and investor portfolios require an active premium plan.

  • Complete investor list
  • Round participation
  • Investor portfolios
  • Co-investor network

Verified entity values are shown only after access is granted.

Timeline of Siltectra

4 dated milestones of Siltectra across 8 years, from founding to its latest funding, stage changes and deals.

  1. Founded Siltectra is founded.
  2. Funding First funding round.
  3. Funding Latest funding round, Series A,.
  4. Exit Acquired by Infineon.
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Frequently Asked Questions about Siltectra

Siltectra was founded in 2010 and raised its 1st funding round 3 years after it was founded.

Siltectra is headquartered in Dresden, Germany. It is registered at Dresden, Saxony, Germany.

Siltectra was founded in 2010 in Dresden, Germany, where laser-based technology for splitting crystalline materials, including silicon carbide (SiC), is developed. Thermal stress is employed to cleave materials along desired planes with minimal loss, outperforming traditional sawing in efficiency. Wafer yield per boule is thereby increased, while consumable costs are lowered. The technology is utilized in semiconductor manufacturing and other sectors requiring precise material separation.

Siltectra offers Cold Split Technology and SiC Wafer Production.

Siltectra has 3 investors. Key investors include Infineon, MIG Fonds, and Global Asset Fund.

Siltectra operates through Siltectra Gmbh.

Yes. Siltectra was acquired by Infineon in November 2018.

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