Thinksemi infotech

Chennai, India Founded: 2016 • Age: 10 yrs
Electronics manufacturing services for PCB assembly and prototyping across industries.
Annual revenue $2.6M Latest available
Total funding - Funding intelligence
Employees - Tracked headcount
Investors - Known backers
Products 4 Services tracked
Competitors 10 Brand Intelligence

About Thinksemi infotech

Thinksemi infotech is a company based in Chennai (India) founded in 2016 by Sudharsan Ramajeyam. It operates as a B2B. Thinksemi infotech offers products and services including PCB Assembly, SMT Assembly, Through-Hole Assembly, and Prototyping. Thinksemi infotech operates in a competitive market with competitors including SFO Technologies, Kaynes Technology, Dixon Technologies, VVDN and TT Electronics, among others.

  • Headquarter Chennai, India
  • Founders Sudharsan Ramajeyam
  • Sectors
    Technology
  • Email
    ***********
  • Phone
    *********
  • Website
    *********
  • Social
    *********
  • Legal Name Thinksemi Infotech Private Limited
  • Date of Incorporation 11 Jul, 2016
  • Jurisdiction Kanchipuram, Tamil Nadu, India
Operational Areas
Technology → Semiconductors, Electronics & Hardware
Key Metrics
  • Annual Revenue
    $2.64 M (USD)
    13.63
    as on Mar 31, 2023
  • Net Profit
    $118.35 K (USD)
    -39.38
    as on Mar 31, 2023
  • EBITDA
    $244.54 K (USD)
    -14.91
    as on Mar 31, 2023
  • Latest Funding Round
  • Investors
  • Employee Count
    Employee Count
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Products & Services of Thinksemi infotech

Thinksemi infotech offers a comprehensive portfolio of products and services, including PCB Assembly, SMT Assembly, Through-Hole Assembly, and Prototyping.

Primary

Service for assembling printed circuit boards with precision.

Surface mount technology for efficient PCB component placement.

Manual assembly method for complex PCB components.

Quick-turn services for testing electronic prototypes.

Funding Insights of Thinksemi infotech

Investments & Acquisitions by Thinksemi infotech

Investments

Financial Statements - Thinksemi infotech

Thinksemi Infotech Comparisons

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Competitors of Thinksemi infotech

Thinksemi infotech operates in a dynamic and competitive business environment, facing competition from various established players and emerging companies in the market. The competitive landscape includes prominent companies such as SFO Technologies, Kaynes Technology, Dixon Technologies, VVDN and TT Electronics, among others.

Company Name Domain Founded year HQ Location Description
domain founded_year HQ Location
Provider of ODM plus solutions for diverse industries
domain founded_year HQ Location
Integrated electronics manufacturing and IoT solutions are delivered across industries.
domain founded_year HQ Location
Electronics manufacturing services are provided for consumer and home products.
domain founded_year HQ Location
Software, product engineering, and electronic manufacturing services are provided.
domain founded_year HQ Location
Manufacturer of automotive parts
domain founded_year HQ Location
Electronic contract manufacturing and design services are offered.

Latest news on Thinksemi Infotech

Frequently Asked Questions about Thinksemi infotech

Thinksemi infotech was founded in 2016.

Thinksemi infotech is headquartered in Chennai, India. It is registered at Chennai, Tamil Nadu, India.

Annual revenue of Thinksemi infotech is $2.64M as on Mar 31, 2023.

Think Semi Infotech Specializes In Electronics Manufacturing, Offering Pcb Assembly Services Like Smt And Through-hole Assembly. They Operate A State-of-the-art Facility In Chennai, India, With Branches In Bengaluru And Singapore. The Company Serves Various Industries Including Automotive, Medical, And Defense, Ensuring High-quality Production And Quick Delivery Through Automated Processes And International Standards. Their Skilled Team Focuses On Prototyping And Full-scale Manufacturing For Global Clients.

Thinksemi infotech's top competitors include SFO Technologies, Kaynes Technology and Dixon Technologies.

Thinksemi infotech offers PCB Assembly, SMT Assembly, Through-Hole Assembly, and Prototyping.

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