About Tsinghua Unigroup
Tsinghua Unigroup is a company based in Beijing (China) founded in 1988 was acquired by JAC Capital in April 2022. Tsinghua Unigroup has raised $1.52 billion across 3 funding rounds from investors including Credit Suisse, Fii and JAC Capital. Tsinghua Unigroup has completed 3 acquisitions, including H3C Technologies, Linxens and XMC. Tsinghua Unigroup operates in a competitive market with competitors including Marvell, AMD, Infineon, Intel and Cavium Networks, among others.
- Headquarter Beijing, China
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Sectors
Technology
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Email
Locked
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Phone
Locked
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Website
Locked
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Social
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Annual Revenue
Not available
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Net Profit
Not available
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EBITDA
Not available
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Total Equity Funding
$1.52 B (USD)
in 3 rounds
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Latest Funding Round
$64.91 M (USD), Series B
Jul 15, 2026
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Investors
Credit Suisse
& 3 more
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Employee Count
Not available
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Investments & Acquisitions
H3C Technologies
& 2 more
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Acquired by
JAC Capital
(Apr 04, 2022)
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Funding Insights of Tsinghua Unigroup
Tsinghua Unigroup has successfully raised a total of $1.52B across 3 strategic funding rounds. The most recent funding activity was a Series B round of $64.91 million completed in July 2026. This substantial capital infusion reflects strong investor confidence in the company's business model, growth potential, and market opportunities. The funding enables strategic expansion, product development, market penetration, and operational scaling to drive long-term value creation and competitive advantage.
Investors in Tsinghua Unigroup
Tsinghua Unigroup has secured backing from 4 investors, including institutional and venture fund investors. Prominent investors backing the company include Credit Suisse, Fii and JAC Capital.
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Communication network and cloud service equipment are manufactured by Fii.
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Investor details for Tsinghua Unigroup
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Investments & Acquisitions by Tsinghua Unigroup
Tsinghua Unigroup has strategically engaged in corporate development activities, having acquired 3 companies. Notable acquisitions include H3C Technologies, Linxens and XMC.
Investment portfolio details for Tsinghua Unigroup
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| Company Name | Description | Domain | Location | Founded Year | Amount |
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12-inch wafer fabrication services for specialized semiconductor processes are provided.
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OpenStack-based cloud OS is developed for heterogeneous resources.
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Microconnectors, RFID antennas, and secure ID components are manufactured.
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Locked | Locked | 1988 | Locked |
Complete acquisition details for Tsinghua Unigroup
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Financial Statements - Tsinghua Unigroup
Detailed financials for Tsinghua Unigroup
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Tsinghua Unigroup Comparisons
Peer comparison for Tsinghua Unigroup
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Competitors of Tsinghua Unigroup
Tsinghua Unigroup operates in a dynamic and competitive business environment, facing competition from various established players and emerging companies in the market. The competitive landscape includes prominent companies such as Marvell, AMD, Infineon, Intel and Cavium Networks, among others.
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Semiconductor integrated circuits are manufactured, including processors and transceivers.
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High-performance CPUs and GPUs are developed for computing applications.
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Multiple analog and mixed-signal ICs are manufactured for various applications.
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Semiconductor ICs and microprocessors are designed and manufactured.
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ARM and MIPS processors are developed for intelligent networks.
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AI-based silicon IP and chip solutions are developed and licensed.
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Detailed competitors of Tsinghua Unigroup
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Latest news on Tsinghua Unigroup
Complete news archive for Tsinghua Unigroup
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Frequently Asked Questions about Tsinghua Unigroup
Tsinghua Unigroup was founded in 1988 and raised its 1st funding round 30 years after it was founded.
Tsinghua Unigroup is headquartered in Beijing, China.
Zhao Weiguo is the current CEO of Tsinghua Unigroup.
Tsinghua Unigroup is a funded company, having raised a total of $1.52B across 3 funding rounds to date.
Tsinghua Unigroup was founded in 1988 and is headquartered in Beijing, China. Operations focus on the semiconductor sector, where chips and cloud servers are designed and developed for applications including memory, mobile communications, smart security, reconfigurable system chips, Internet of Things, digital TV, AI, smart cards, RFID antennas, and micro-connections. Solutions target the cellular and connectivity markets.
Tsinghua Unigroup has made 3 acquisitions, including H3C Technologies, Linxens, and XMC.
Tsinghua Unigroup has 4 investors. Key investors include Credit Suisse, Fii, JAC Capital, and Coco Capital.