Khanna Bond Solder Manufacturers Private Limited - Loans (Charges)
Founded in 2022 and headquartered in Delhi, India.
2022 | Delhi, Delhi (India) | Active
Khanna Bond Solder Manufacturers Private Limited loan details
Charges taken from banks & financial institutes
Amount in (₹)
Charges Breakdown by Lending Institutions
- The Hongkong And Shanghai Banking Corporation Limited : 40.00 Cr
₹ 40.00 crore
-
1
The Hongkong And Shanghai Banking Corporation Limited
Creation
01 Jul 2025
₹ 40.00 cr
| Charge Id | Lender | Amount | Creation Date | Last Modification Date | Satisfaction Date | Status | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 101128212 View Details | The Hongkong And Shanghai Banking Corporation Limited | ₹ 40.00 | 01 Jul 2025 | - | - | Open | |||||
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