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Mold-Tek Packaging Limited loan details

Charges taken from banks & financial institutes
Amount in (₹)

Charges Breakdown by Lending Institutions

  • Citi Bank N.A. : 205.00 Cr
  • The Hongkong And Shanghai Banking Corporation Limited : 50.10 Cr
  • Others : 28.00 Cr

₹283.10 crore

₹96.10 crore

7

Citi Bank N.A.

Modification

14 May 2026

₹28.00 cr

Charge Id Lender Amount Creation Date Last Modification Date Satisfaction Date Status
100278901 View Details Citi Bank N.A. 20.00 31 Jul 2019 31 Jul 2019 03 Sep 2024 Satisfied 200000000.0
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